From Idea to Profitability
OPTOELECTRONIC PACKAGING/OPTICS
Opto component solder joint integrity: Lucent
Problem
Optical components were falling off the substrate after soldering at the end of the production line
Not clear why this was happening or how to fix it.
Solution / Process
Auger analysis revealed the presence of NiO over the Au on the bonding surface
NiO was not bonding to the solder and the component was falling off
Discovered the root cause to be a high-temperature glass solder process at the supplier was being done after the Au plating allowing Ni bleed through and NiO formation
Many attempts were made to remove the NiO but it is very tough and could not be removed with normal plasma cleaning or with formic acid
The only effective way to remove the NiO was to blast it off with high energy ion beam
A fixture was designed and built to accomplish this in the Balzer ion etching machine
Wavelength Locker Technology: Infinera
Problem
Wavelength locker glass etalon FSR is very sensitive to angle alignment
Requires accurate and time consuming measurements with nano-positioning stages to achieve accurate alignment
Normally this process takes upwards of 20 – 30 minutes to complete
Solution
A method was found to reduce this time to less than 4 minutes – Trade Secret at Infinera
Subsequently a technology was created to achieve a 90% size reduction in the wavelength locker assembly – Trade Secret at Infinera
Wavelength Locker Technology: Lucent
Problem
If a wavelength locker with etalon has to operate at various unspecified temperatures, such as for a temperature tuned laser on a common submount:
The locking point for the etalon transmission function may be at a peak or valley
This can result in locker insensitivity at the locking wavelength
A stepped etalon prevents this by having overlapping transmission functions
This was the predecessor to the Wavelength Locker at Infinera
Advanced solder bonding techniques for optoelectronic packages: Infinera
Problem
Eliminate voiding from thermal critical areas of solder joints, improve yields in hermetic optoelectronic packages
Solution
Alternative solders investigated and new profiles developed to improve yields to >99%
Innovative thermal management fixturing developed to shorten cycle time and improve yields, including thermal measurement and analysis
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Microsystems Packaging - Graduate Level Course: Lehigh University
Purpose of Service / Project
Familiarize students with the fundamentals of optoelectronic and microelectronic packaging including mechanical design, optics, fiber optics, materials, thermal management, process development, and team building
Fiber Optic Communications and Components: Professional development course created at Northampton Community College, National Training Center for Microelectronics
Purpose of Service / Project
Familiarize students with the history, practical application, case studies and state of the art in fiber optic communications and enabling optoelectronic components. Presented to students at the college, the National Security Agency, IMAPS professional society conferences and employees at Lucent Technologies.
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Distributed Isolator Laser Hammering Birefringence Compensation: Lucent
Laser Integrated Modulator: T-Networks - Hybrid Photonic Integrated Circuit
